Automated Optical Inspection (AOI) Systems
Advanced 2D-3D AOI technology with AI-powered defect detection for comprehensive post-reflow PCB inspection and assembly verification
What is Automated Optical Inspection?
Automated Optical Inspection (AOI) is a critical quality control technology used in electronics manufacturing to inspect printed circuit board assemblies after the reflow soldering process. AOI systems use advanced cameras and intelligent algorithms to detect defects in component placement, solder joint quality, and overall assembly integrity.
ASC International's AOI systems combine 2D and 3D imaging technologies with artificial intelligence and machine learning to provide comprehensive inspection coverage. Our systems detect a wide range of defects including missing components, wrong components, component skew, tombstoning, solder bridges, insufficient solder, and many others.
By catching defects immediately after reflow, AOI systems prevent defective boards from moving forward in production, reducing rework costs and improving overall manufacturing yield.
Key Features & Benefits
True 3D Imaging
Advanced 3D reconstruction for accurate solder joint inspection and component height verification
AI-Powered Detection
Machine learning algorithms continuously improve defect recognition and reduce false calls
High-Speed Inspection
Inspect full PCB assemblies at production speeds without compromising accuracy
Comprehensive Defect Library
Detects 50+ defect types including component and solder defects
Advanced Analytics
Real-time SPC, trend analysis, and defect pareto charts for process optimization
Easy Programming
Auto-programming from CAD data and intuitive teach mode for fast setup
Defect Detection Capabilities
Component Defects
- Missing components
- Wrong component type
- Wrong polarity
- Component shift/skew
- Lifted leads
- Tombstoning
- Billboard effect
- Component damage
Solder Joint Defects
- Insufficient solder
- Excessive solder
- Solder bridges
- Cold solder joints
- Dewetting
- Solder balls
- Voiding
- Non-wetting
Common Applications
Post-Reflow Inspection
Complete assembly verification after reflow soldering process
High-Volume Manufacturing
Fast, reliable inspection for high-throughput production lines
Complex Assemblies
Inspection of double-sided boards, BGAs, and fine-pitch components
Traceability & Documentation
Complete image archiving and defect documentation for quality records
Technical Specifications
| Imaging Technology | 2D color + 3D structured light |
| Camera Resolution | Up to 29 megapixel per image |
| XY Resolution | 10μm - 15μm (configurable) |
| Height Measurement | ±2μm accuracy |
| Inspection Speed | Up to 120cm²/sec |
| Board Size Range | 50mm × 50mm to 510mm × 510mm |
| Board Thickness | 0.4mm - 8.0mm |
| Minimum Component | 01005 (0.4mm × 0.2mm) |
| Programming | Auto-programming from Gerber/CAD, Teach mode |
| Communication | IPC-CFX, SECS/GEM, SMEMA, Ethernet |
Improve Assembly Quality with Advanced AOI
Contact our experts to learn how ASC's AOI systems can reduce defects and improve yield in your production line