Inspection Insights Blog
Expert articles on electronics inspection, quality control, and manufacturing best practices
3D SPI vs 2D SPI: Why the Third Dimension Matters
Discover why 3D solder paste inspection provides superior defect detection compared to 2D systems, and when the investment makes sense for your operation.
How to Reduce False Calls in Automated Optical Inspection
False calls waste production time and reduce confidence in AOI systems. Learn proven strategies to minimize false positives while maintaining defect detection.
Understanding IPC-A-610 Class 2 vs Class 3 Requirements
IPC-A-610 defines acceptability standards for electronic assemblies. Understanding the differences between Class 2 and Class 3 is critical for setting inspection criteria.
Calculating ROI for Inspection Equipment: A Complete Guide
Inspection systems require significant investment. Learn how to calculate expected ROI including hard and soft costs, and typical payback periods.
The Critical Role of SPI in Preventing Solder Defects
Studies show 60-70% of solder defects originate at the paste printing stage. Discover how 3D SPI catches these defects early when they're easiest to fix.
Automotive Electronics: Meeting Zero-Defect Requirements
Automotive OEMs demand PPM defect rates in single digits. Learn about inspection strategies and documentation required for automotive electronics manufacturing.
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