3D Solder Paste Inspection (SPI) Systems
Industry-leading 3D inspection technology for precise solder paste volume, height, and area measurement in PCB manufacturing
What is 3D Solder Paste Inspection?
3D Solder Paste Inspection (SPI) is a critical quality control process in electronics manufacturing that measures the volume, height, and area of solder paste deposits on printed circuit boards (PCBs) after the printing process and before component placement.
ASC International's 3D SPI systems use advanced optical technology and sophisticated algorithms to detect solder paste defects including insufficient volume, excessive volume, bridging, misalignment, and shape irregularities. Early detection of these defects prevents costly rework and improves overall manufacturing yield.
Key Features & Benefits
High Accuracy
Precise 3D measurement with ±1μm height resolution for accurate solder paste volume calculation
Fast Inspection Speed
High-speed inspection up to 85cm²/sec for maximum production throughput
Real-Time SPC
Statistical process control with trend analysis for continuous process improvement
Industry 4.0 Ready
Full factory integration with IPC-CFX, SECS/GEM, and custom API support
Flexible Configuration
Available in inline and offline configurations to fit your production line
Proven Reliability
32+ years of experience with installations in over 1,000 factories worldwide
Common Applications
SMT Assembly Lines
Critical quality checkpoint after solder paste printing, before component placement
High-Mix Production
Fast program changeover for facilities producing multiple PCB designs
Fine-Pitch Components
Precise inspection of 01005 components and ultra-fine pitch BGAs
Process Optimization
Data-driven printer optimization and maintenance scheduling
Technical Specifications
| Inspection Technology | Phase-shift 3D measurement |
| Height Resolution | ±1μm |
| XY Resolution | 10μm - 20μm (configurable) |
| Inspection Speed | Up to 85cm²/sec |
| Board Size Range | 50mm × 50mm to 510mm × 460mm |
| Board Thickness | 0.4mm - 6.0mm |
| Communication Protocols | IPC-CFX, SECS/GEM, SMEMA |
| Software Features | SPC, Auto-programming, 3D viewer, Trend analysis |
Ready to Improve Your Solder Paste Process?
Contact our experts to learn how ASC's 3D SPI systems can reduce defects and increase yield in your production line